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High Energy Corporation
256-channel cmos spad line sensor 256 Channel Cmos Spad Line Sensor, supplied by High Energy Corporation, used in various techniques. Bioz Stars score: 90/100, based on 1 PubMed citations. ZERO BIAS - scores, article reviews, protocol conditions and more https://www.bioz.com/result/256-channel cmos spad line sensor/product/High Energy Corporation Average 90 stars, based on 1 article reviews
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Hamamatsu
cmos line sensor s13131-512 ![]() Cmos Line Sensor S13131 512, supplied by Hamamatsu, used in various techniques. Bioz Stars score: 90/100, based on 1 PubMed citations. ZERO BIAS - scores, article reviews, protocol conditions and more https://www.bioz.com/result/cmos line sensor s13131-512/product/Hamamatsu Average 90 stars, based on 1 article reviews
cmos line sensor s13131-512 - by Bioz Stars,
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Image Search Results
Journal: Advanced Science
Article Title: Wearable Hyperspectral Photoplethysmography Allows Continuous Monitoring of Exercise‐Induced Hypertension
doi: 10.1002/advs.202417625
Figure Lengend Snippet: A schematic illustration for continuous monitoring of blood pressure using wearable hyperspectral photoplethysmography (PPG) sensor with double‐folded solid immersion grating microspectrometer (DFSIG‐µSPEC). a) The wearable hyperspectral PPG module comprises DFSIG‐µSPEC and a white LED. Light emitted from the LED penetrates the skin and undergoes reflection. The reflected light passes through a silicon microslit, dispersed through the solid immersion grating (SIG), undergoing multiple reflections and refractions with plane mirrors and a convex lens. Dispersed light delivers PPG signals on a CMOS line sensor at the level of hyperspectral range. Measured spectra are accumulated into 3D PPG datasets over time. Hyperspectral PPG signals allow the precise calculation of continuous arteriolar pulse transit time (aPTT) for blood pressure estimation. b) The microfabrication steps and module integration of DFSIG‐µSPEC. The SIG is microfabricated by using wafer stepper lithography and reactive ion etching (step i), and metallized with an aluminum thin layer (step ii). A convex lens is molded with PDMS (step iii). The SIG and a CMOS line sensor are mounted on a printed circuit board (PCB), and integrated with a silicon microslit. c) An optical image of DFSIG‐µSPEC, fully‐packaged with a module thickness of 5.8 mm. d,e) Captured optical image for wrist‐wearable configuration of (d) fully‐integrated HS‐PPG module and (e) white LED module.
Article Snippet: The silicon microslit was mounted onto the printed circuit board (PCB) with the
Techniques: